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National Semiconductor Corporation
行业: Semiconductors
Number of terms: 2987
Number of blossaries: 0
Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
A rebond placed directly over a previous bond.
Industry:Semiconductors
Leads emanating from the same side of a package but bent in alternating directions such that they will insert into two or more parallel lines of mounting holes.
Industry:Semiconductors
A custom or semicustom integrated circuit, such as a cell or gate array, created for a specific application. The complexity of ASICs typically requires significant use of CAD techniques.
Industry:Semiconductors
See RAM.
Industry:Semiconductors
A document developed for the purpose of detailing all of the testing involved in device and/or lot acceptance.
Industry:Semiconductors
A quality control system utilizing statistical analysis of process defect data to detect quality trends on a real time basis.
Industry:Semiconductors
Gross quantitative data indicating the total number of devices subjected to and passing or failing the various screening steps in a test sequence.
Industry:Semiconductors
A bonding technique whereby the tip of the bonding wire is fed under the bonding head, which then applies heat and pressure to "stitch" the wire to the pad or post. Frequently several stitches will be employed on the same bond. Stitch bonding can be visually differentiated from ultrasonic bonding because the impressions normally run across the bond rather than along its length.
Industry:Semiconductors
Random surveillance of processes, specifications, etc.
Industry:Semiconductors
The physical material upon which an integrated circuit is fabricated or assembled. For a monolithic device, this would be the silicon of the chip; for a hybrid it would be the alumina or ceramic surface upon which the die and other elements are deposited.
Industry:Semiconductors