Any solid material with electrical conductivity due to electron flow (as opposed to ionic conductivity) of a magnitude between that of a conductor and that of an insulator.
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切片表面与晶体生长平面之间的角度。最常见的切片方向是
许多（通常）小的单晶区域随机连接形成一个固体；区域的大小取决于材料和它的形成方法。重掺杂多晶硅通常用作硅MOS器件和硅CMOS器件的栅极接触。 ...
含悬浮磨料组分的液体。用于研磨，抛光固体表面。可以是化学活性的。是CMP流程的关键成分。
